A new Merging Unit Development Kit based on the NovTech IoT Smart Grid Platform with Intel Cyclone V SoC Core is available for your next project.
Utility companies are adapting their infrastructures to support bidirectional energy flow to handle the emergence of DER (Distributed Energy Resources) via microgrids, photovoltaic panels, and local energy storage. As distributed energy generation increases, new intelligence of sensors, measurement and protection equipment will be required to process data at the edge. Also with the increase in variable DER, it is more challenging for substations to deliver sinusoidal and predictable steady-state voltage and current. Utility companies rely on substation metering of secondary voltage (VT) and current transformer (CT) circuits to detect performance issues and to provide vital information in real time to distributed digital protection nodes.
To satisfy this need, SystemCORP and Intel developed an IEC 61850-9-2LE compliant merging unit solution in form of a demonstrator/development platform.
This development kit consists of 6 parts:
Utility companies are adapting their infrastructures to support bidirectional energy flow to handle the emergence of DER (Distributed Energy Resources) via microgrids, photovoltaic panels, and local energy storage. As distributed energy generation increases, new intelligence of sensors, measurement and protection equipment will be required to process data at the edge. Also with the increase in variable DER, it is more challenging for substations to deliver sinusoidal and predictable steady-state voltage and current. Utility companies rely on substation metering of secondary voltage (VT) and current transformer (CT) circuits to detect performance issues and to provide vital information in real time to distributed digital protection nodes.
To satisfy this need, SystemCORP and Intel developed an IEC 61850-9-2LE compliant merging unit solution in form of a demonstrator/development platform.
This development kit consists of 6 parts:
- NovTech IoT Octopus Smart Grid IoT Platform
- SystemCORP VT/CT Interface board
- SystemCORP IEC 61850-9-2LE Sample Value software stack (PIS-11) on ARM Cortex A9 core 1
- SystemCORP IEC standard 61850 server/client software stack (PIS-10) on ARM Cortex A9 core 2 (optional)
- Flexibilis embedded FPGA analogue front-end IP core
- Flexibilis Ethernet PRP/HSR FPGA IP core (optional)
Click HERE for more information.