Power System Communication Committee Event
Wednesday, July 28, 2010 18:00-21:00 MCC 209B
IEC 61850-on-a-Chip – Presentation and demonstration of a break-through implementation of the Standard 61850 on a small footprint programmable microcontroller chip for simple to complex applications by Beck IPC (Pohlheim, Germany)
Beck IPC (Pohlheim, Germany) invites to a Presentation and Demonstration of the low cost Beck Chip implementing IEC 61850 (IEC 61400-25):
Location: IEEE PES GM, Minneapolis Convention Center
Room: 209 B (Level Two)
Date and time: Wednesday, 28 July 2010, 6 p.m. – 9 p.m.
Food and drinks will be provided.
The IEC 61850 standard is the most successful standard for protection and substation automation communication for both HV and MV. The standard is intended to be used in centralized and distributed power generation as well as in distribution automation.
The high cost for the implementation of IEC 61850 is one of the crucial reasons the standard is currently being used in relatively few applications in DER systems and low voltage applications. Since the Hanover Fair 2010 (Hanover/Germany) in April 2010 this has been changed completely: A powerful and low price embedded and freely programmable Microcontroller implementing IEC 61850 has been demonstrated – the IPC@CHIP®.
The development of affordable standards-conformant interfaces for distributed energy resources can now be shortened from months or even years to days or weeks.
At this Wednesday evening event we will discuss the range of all crucial Beck IPC products (Chips, modules, Development kits, …) and related products, e.g., IEC 61850, Modbus, IEC 60870-5, and DNP3 stack software from SystemCorp (Perth, Australia):.
Click HERE for more details.
Click HERE for the Floor plan of Level 2 of the MCC.
Please drop by to view the demonstration and discuss with the experts from Beck, SystemCorp and NettedAutomation - this event may accelerate your development of IEDs that speak IEC 61850 (IEC 61400-25).
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