The second day was similar compared to the first day. I have talked about IEC 61850 and IEC 61400-25 to many domain experts that showed serious interest in my training services. Most had been quite surprised that there is a global interest in IEC 61850.
When I showed them the list of the 175+ training sessions I conducted over the last 10 years, they were really amazed.
The documents I have handed-out at the exhibition are now available for download:
General Information about IEC 61850, Smart Grid, products, … [pdf, 4.1 MB]
Training information, program example, list of references [pdf, 3.0 MB]
Standards information, List of Logical Nodes, UML examples [pdf, 850 KB]
Brief description of Lite Gateway IEC 61850 / IEC 60870-5-104 [pdf, 480 KB]
At the end of the day several interested people came by that wanted to learn more about IEC 61850 – they will be served today (Thursday, January 31, the last day of the DistribuTECH 2013.
The third day was quite busy. Several domain experts in the power distribution world contacted me to get the latest information regarding to IEC 61850.
Summary: This event was the most busiest and successful DistribuTECH I have visited since 2009! The situation regarding IEC 61850 is changing quite fast: vendors of various products for substations and distribution systems need to offer IEC 61850 connectivity even for IEDs that have been on the market for some time. One of the easiest and most convenient solutions seems to be the Beck IPC Chip that could be implemented on a small PCB and mounted in the existing housing – it’s that easy:
More details on the chip, its architecture and IEC 61850 support could be found in the fist document (General …) listed above.
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