Tuesday, April 8, 2014

Brief Report from the Hannover Messe (after second day)

This is the fifth Hannover Fair for Beck IPC demonstrating IEC 61850 solutions. In 2010 Beck presented the first “IEC 61850 @ Chip”. Now – four years later – the market is looking for easy to use and reasonable priced IEC 60870-5-104, DNP3, IEC 61850, IEC 61400-25, … solutions!

The booth at the Hannover Messe in 2014 is quite small – but visited by many experts from experts users and manufacturers of many application domains from all over: Power transmission, distribution, renewable power, virtual power systems, building automation, asset management, …

… Beck IPC is partner of the Smart Grid Forum:


… the booth was visited by almost 100 experts during the first two days:


The key products are the com.tom devices that could be used to collect the process data, process them and communicate the results through IEC 60870-5-104, IEC 61850, IEC 61400-25, cloud portal, … Gateways between these protocols.

In case you want to see the most simple IEC 60870-5-104, IEC 61850, … in action, please visit the above booth C35/7 in Hall 13.

I look forward to meeting you at the above booth.

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